TELEOFIS RX300-R4 [2/4] Ehs5 wireless module highly efficient 3g in a 2g footprint
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TELEOFIS RX300-R4 [2/4] Ehs5 wireless module highly efficient 3g in a 2g footprint

TELEOFIS RX300-R4 [2/4] Ehs5 wireless module highly efficient 3g in a 2g footprint
Cinterion
®
EHS5 Wireless Module
Highly Efficient 3G in a 2G Footprint
The Cinterion EHS5 module represents a milestone in
embeddeded Java machine-to-machine (M2M) communica-
tion, offering smart connectivity for industrial applications.
EHS5 delivers highly efficient 3G communication in an
ultra-compact footprint. EHS5 is an ideal solution for
M2M applications moving to 3G technology with a focus on
long-lasting, futureproof and cost efficient M2M applications.
Offering a backward and forward compatible footprint, its
multi design capability offers seamless migration and
unmatched flexibility to choose frequency bands and global
roaming whenever needed.
The platform incorporates an improved Java concept using
Multi MIDlet Java execution to simultaneously host and run
multiple applications and protocols. An extended security
concept with the latest TLS/SSL engine provides secure and
reliable TCP/IP connectivity while an enriched internal flash
file system enables royalty free firmware updates over-the-
air (FOTA) when required. Sophisticated sandbox modeling
and layered architectures simplify device management (DM)
and separate mobile network operator approvals from
application code development, allowing simultaneous
progress of both phases for a shorter time to market.
Powered by Intel’s latest HSPA+ baseband, the next genera-
tion of the award-winning Evolution platform features high
speed data communication with 7.2 Mbps (max) in the
downlink and 5.76 Mbps (max) in the uplink.
The tiny EHS5 comes in Gemalto M2M’s unique LGA (Land
Grid Array) package perfectly suited to the manufacturing
needs of small, high-volume M2M devices with a focus on
reliable and efficient processes. EHS5 supports voice and
data communication and best in class low power consump-
tion incorporated with common industrial interfaces such as
USB and serial interfaces.
EHS5 is available in two variants: EHS5-US (850/1900 MHz)
for North America, and EHS5-E (900/2100 MHz) for the rest of
the world.
Perfect M2M at
Minimal Footprint
LGA technology
Land grid array, or LGA, is a surface-mount technology for fully automated
manufacturing allowing to benefit from efficiency and process consistency.
Gemalto M2M’s unique type of LGA technology is designed with focus on
highest reliability and flexibility and to meet the demanding requirements of
M2M application manufacturers.
Multi Design Capability
The unique EHS5 footprint, based on LGA technology, offers seamless
migration from 2G to 3G within a single design footprint. Compatibility with
the world’s smallest HSPA wireless module ensures future-proof design
and longevity of M2M applications.
Java
TM
Java offers easy and fast application development, a broad choice of tools, high
code reusability, easy maintenance, a proven security concept, on-device
debugging as well as multi-threading programming and program execution.
Local engineers, a competent helpdesk,
a dedicated team of R&D specialists and
an advanced development center are the
hallmarks of our leading support offer.
Gemalto M2M Support includes:
> Personal design-in consulting for
hardware and software
> Extensive RF test capabilities
> GCF/PTCRB conform pretests to
validate approval readiness
> Regular training workshops
— PRELIMINARY VERSION —
18.8 mm
27.6 mm

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