Daikin EKCMBACMSTP [10/20] Ekcmlon

Daikin EKCMBACMSTP [10/20] Ekcmlon
•LON
8
ɋɧɚɛɠɟɧ ɦɟɠɩɥɚɬɧɵɦ ɪɚɡɴɟɦɨɦ ZEC1,0/4-LPV-3,5 GY35AUC2CI1
LON
ɋɦ. ɪɭɤɨɜɨɞɫɬɜɨ ɩɨ LON
ɗɤɫɩɥɭɚɬɚɰɢɹ IEC 721-3-3
Ɍɟɦɩɟɪɚɬɭɪɚ -40...70 °C
ȼɥɚɠɧɨɫɬɶ ɨɬɧ. ɜɥɚɠɧɨɫɬɶ <90%
Ⱥɬɦɨɫɮɟɪɧɨɟ
ɞɚɜɥɟɧɢɟ ɦɢɧ. 700 hɉɚ ɫɨɨɬɜɟɬɫɬɜɭɟɬ ɦɚɤɫ. 3000 ɦ
ɧɚɞ ɭɪɨɜɧɟɦ ɦɨɪɹ
Ɍɪɚɧɫɩɨɪɬɢɪɨɜɤɚ IEC 721-3-2
Ɍɟɦɩɟɪɚɬɭɪɚ -40...+70 °C
ȼɥɚɠɧɨɫɬɶ ɨɬɧ. ɜɥɚɠɧɨɫɬɶ <95%
Ⱥɬɦɨɫɮɟɪɧɨɟ
ɞɚɜɥɟɧɢɟ ɦɢɧ. 260 hɉɚ ɫɨɨɬɜɟɬɫɬɜɭɟɬ ɦɚɤɫ. 10 000
ɦ ɧɚɞ ɭɪɨɜɧɟɦ ɦɨɪɹ
ɋɬɟɩɟɧɶ ɡɚɳɢɳɟɧɧɨɫɬɢ IP20 (EN 60529)
Ȼɟɡɨɩɚɫɧɨɫɬɶ ɢɡɞɟɥɢɹ
Ⱥɜɬɨɦɚɬɢɱɟɫɤɢɟ ɷɥɟɤɬɪɨɪɟɝɭɥɹɬɨɪɵ EN 60730-1
ɗɥɟɤɬɪɨɦɚɝɧɢɬɧɚɹ ɫɨɜɦɟɫɬɢɦɨɫɬɶ
ɉɨɦɟɯɨɭɫɬɨɣɱɢɜɨɫɬɶ EN 60730-1 +A16
ȼɵɛɪɨɫɵ EN 60730-1 +A16
ɋɨɨɬɜɟɬɫɬɜɢɟ ɧɨɪɦɚɦ ȿɋ
Ⱦɢɪɟɤɬɢɜɚ ɩɨ ɗɆɋ 2004/108/EC
Ⱦɢɪɟɤɬɢɜɚ ɩɨ ɧɢɡɤɨɦɭ ɧɚɩɪɹɠɟɧɢɸ 2006/95/EC
ɉɟɪɟɱɧɢ
UL916, UL873
CSA C22.2M205
Ⱦɢɪɟɤɬɢɜɚ RoHS
2002/95/EC (ȿɜɪɨɩɚ)
ACPEIP (Ʉɢɬɚɣ)
Ɇɨɞɭɥɶ LON POL906.00/STD
EKCMLON
Ʉɧɨɩɤɚ ɤɨɧɬɚɤɬɚ ɞɥɹ
ɨɛɫɥɭɠɢɜɚɧɢɹ >
ɢɫɩɨɥɶɡɭɟɬɫɹ ɞɥɹ
ɚɞɪɟɫɚɰɢɢ ɩɨ LON
Ⱦɢɚɝɧɨɫɬɢɱɟɫɤɢɟ ɫɜɟɬɨɞɢɨɞɵ
BSP ɢ BUS (ɡɟɥɟɧɵɣ, ɤɪɚɫɧɵɣ
ɢ ɠɟɥɬɵɣ)
Ɋɟɠɢɦ ɋɨɫɬɨɹɧɢɟ ɫɜɟɬɨɞɢɨɞɚ BUS
ɋɜɹɡɶ ɩɨ LON ɭɫɬɚɧɨɜɥɟɧɚ Ƚɨɪɢɬ ɡɟɥɟɧɵɣ
ɂɧɢɰɢɚɥɢɡɚɰɢɹ ɫɜɹɡɢ ɩɨ LON Ƚɨɪɢɬ ɠɟɥɬɵɣ
Ⱥɩɩɚɪɚɬɧɚɹ ɨɲɢɛɤɚ Ƚɨɪɢɬ ɤɪɚɫɧɵɣ
Ɋɟɠɢɦ ɋɨɫɬɨɹɧɢɟ ɫɜɟɬɨɞɢɨɞɚ BSP
BSP ɜɤɥɸɱɟɧ ɢ ɭɫɬɚɧɨɜɥɟɧɚ ɫɜɹɡɶ ɫ
ɩɭɥɶɬɨɦ ɭɩɪɚɜɥɟɧɢɹ
Ƚɨɪɢɬ ɡɟɥɟɧɵɣ
BSP ɜɤɥɸɱɟɧ, ɧɨ ɫɜɹɡɶ ɫ ɩɭɥɶɬɨɦ
ɭɩɪɚɜɥɟɧɢɹ ɧɟ ɭɫɬɚɧɨɜɥɟɧɚ
Ƚɨɪɢɬ ɠɟɥɬɵɣ
Ɉɲɢɛɤɚ BSP (ɨɲɢɛɤɚ ɉɈ) Ɇɢɝɚɟɬ ɤɪɚɫɧɵɣ ɫ ɱɚɫɬɨɬɨɣ 2 Ƚɰ
Ⱥɩɩɚɪɚɬɧɚɹ ɨɲɢɛɤɚ Ƚɨɪɢɬ ɤɪɚɫɧɵɣ
Ɋɟɠɢɦ ɨɛɧɨɜɥɟɧɢɹ BSP Ʉɚɠɞɨɟ ɜɬɨɪɨɟ ɩɟɪɟɤɥɸɱɟɧɢɟ ɤɪɚɫɧɨɝɨ
ɢ ɠɟɥɬɨɝɨ
ɋɢɫɬɟɦɧɵɣ
ɢɧɬɟɪɮɟɣɫ
Ɍɢɩɵ ɤɚɛɟɥɟɣ
ɍɫɥɨɜɢɹ ɨɤɪɭɠɚɸɳɟɣ
ɫɪɟɞɵ
Ɂɚɳɢɳɟɧɧɨɫɬɶ
ɋɬɚɧɞɚɪɬɵ
Ⱦɚɧɧɵɟ ɞɥɹ ɡɚɤɚɡɚ
Ʉɨɧɬɚɤɬ ɞɥɹ
ɨɛɫɥɭɠɢɜɚɧɢɹ ɢ
ɞɢɚɝɧɨɫɬɢɱɟɫɤɢɟ
ɫɜɟɬɨɞɢɨɞɵ LON
EEDRU12-436_Cover.pdf 10 8/10/2012 15:55:29

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