IBM system x3530 m4 (7160k2g, 90y8826 х4, 49y3760, 00d4413) Инструкция по эксплуатации онлайн [369/402] 183097

IBM system x3530 m4 (7160k2g, 90y8826 х4, 49y3760, 00d4413) Инструкция по эксплуатации онлайн [369/402] 183097
c. Press firmly on the captive screws and tighten them with a screwdriver.
The follow illustration shows the sequence in tightening the screws, which
is also shown on top of the heat sink. Begin with the screw labeled as "1",
then "2", "3" and finally "4". If possible, each screw should be rotated two
full rotations at a time. Repeat until the screws are tight. Do not
overtighten the screws by using excessive force. If you are using a torque
wrench, tighten the screws to 8.5 Newton-meters (Nm) to 13 Nm (6.3
foot-pounds to 9.6 foot-pounds).
7. If you installed the second microprocessor, install the two fans on Fan
connector 4 and Fan connector 6 of the system board respectively (see
Replacing a hot-swap fan assembly).
8. Reinstall the memory module that you have removed (see “Replacing a
memory module” on page 313).
9. Reinstall the air baffle (see “Replacing the air baffle” on page 66).
10. Reconnect any cables that you have disconnected from the adapters or system
board.
Thermal grease:
The thermal grease must be replaced whenever the heat sink has been removed
from the top of the microprocessor and is going to be reused or when debris is
found in the grease.
When you are installing the heat sink on the same microprocessor that is was
removed from, make sure that the following requirements are met:
v The thermal grease on the heat sink and microprocessor is not contaminated.
v Additional thermal grease is not added to the existing thermal grease on the
heat sink and microprocessor.
Note:
v Read the Safety information on page Safety.
v Read the “Installation guidelines” on page 30.
v Read “Handling static-sensitive devices” on page 32.
To replace damaged or contaminated thermal grease on the microprocessor and
heat sink, complete the following steps:
1. Place the heat sink on a clean work surface.
2. Remove the cleaning pad from its package and unfold it completely.
Chapter 6. Removing and replacing components 353

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