HP 14-am012ur (Z3C61EA) [32/99] Packaging and transporting guidelines
Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
●
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
●
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
●
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
●
Place items on a grounded surface before removing items from their containers.
●
Always be properly grounded when touching a component or assembly.
●
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
●
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
●
Cover the workstation with approved static-shielding material.
●
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
●
Use conductive field service tools, such as cutters, screwdrivers, and vacuums.
●
When fixtures must directly contact dissipative surfaces, use fixtures made only of staticsafe materials.
●
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
●
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
●
Avoid contact with pins, leads, or circuitry.
●
Turn off power and input signals before inserting or removing connectors or test equipment.
22 Chapter 4 Removal and replacement procedures preliminary requirements
Содержание
- Important notice about customer self repair parts 3
- Safety warning notice 5
- Table of contents 7
- Product description 11
- Chapter 1 product description 12
- External component identification 13
- Right side 13
- Right side 3 13
- Chapter 2 external component identification 14
- Left side 14
- Display 15
- Display 5 15
- Chapter 2 external component identification 16
- Touchpad 16
- Lights 17
- Buttons and speakers 18
- Chapter 2 external component identification 18
- Bottom 20
- Chapter 2 external component identification 20
- Labels 21
- Computer major components 23
- Illustrated parts catalog 23
- Chapter 3 illustrated parts catalog 24
- Mass storage devices 25
- Mass storage devices 15 25
- Chapter 3 illustrated parts catalog 26
- Display assembly subcomponents 26
- Note the display assembly subcomponents are for the hp pavilion flat display models only touchsmart models are spared at the display assembly only 26
- Miscellaneous parts 27
- Miscellaneous parts 17 27
- Sequential part number listing 27
- Chapter 3 illustrated parts catalog 28
- Plastic parts 29
- Removal and replacement procedures preliminary requirements 29
- Service considerations 29
- Tools required 29
- Cables and connectors 30
- Drive handling 30
- A discharge of static electricity from a finger or other conductor can destroy static sensitive devices or microcircuitry even if the spark is neither felt nor heard damage may have occurred 31
- An electronic device exposed to esd may not be affected at all and can work perfectly throughout a normal cycle or the device may function normally for a while then degrade in the internal layers reducing its life expectancy 31
- Avoid touching pins leads and circuitry handle electronic components as little as possible 31
- Before touching an electronic component discharge static electricity by using the guidelines described in this section 31
- Caution a product can be degraded by as little as 700 v 31
- Caution to prevent damage to the computer when you are removing or installing internal components observe these precautions 31
- Electronic components are sensitive to electrostatic discharge esd circuitry design and structure determine the degree of sensitivity networks built into many integrated circuits provide some protection but in many cases esd contains enough power to alter device parameters or melt silicon junctions 31
- Electrostatic discharge damage 31
- Grounding guidelines 31
- Grounding guidelines 21 31
- If you remove a component place it in an electrostatic safe container 31
- Keep components in their electrostatic safe containers until you are ready to install them 31
- The following table shows how humidity affects the electrostatic voltage levels generated by different activities 31
- Packaging and transporting guidelines 32
- Workstation guidelines 32
- Equipment guidelines 33
- Component replacement procedures 34
- Removal and replacement procedures for customer self repair parts 34
- Battery 35
- Service door 36
- Memory module 38
- Wlan module 40
- Optical drive 42
- Keyboard 44
- Component replacement procedures 47
- Removal and replacement procedures for authorized service provider parts 47
- Display panel 48
- Top cover 51
- Hard drive 54
- Power button board 57
- Touchpad button board 59
- Optical drive connector cable 60
- System board 62
- Rtc battery 66
- Heat sink assembly 70
- Power connector cable 72
- Speakers 73
- Display assembly subcomponents 76
- Determining the bios version 82
- Starting setup utility bios 82
- Updating the bios 82
- Using setup utility bios 82
- Downloading a bios update 83
- Downloading hp pc hardware diagnostics uefi to a usb device 84
- Using hp pc hardware diagnostics uefi 84
- Backing up restoring and recovering 85
- Creating hp recovery media select models only 85
- Creating recovery media and backups select models only 85
- Restore and recover select models only 86
- Using windows tools 86
- Recovering using hp recovery manager select models only 87
- Using the hp recovery partition select models only 87
- What you need to know 87
- Changing the computer boot order 88
- Using hp recovery media to recover 88
- Computer specifications 89
- Computer specifications 79 89
- Specifications 89
- Chapter 10 specifications 90
- Display specifications 90
- Hard drive specifications 91
- Hard drive specifications 81 91
- Chapter 10 specifications 92
- Dvd rw supermulti double layer combination drive specifications 92
- Power cord set requirements 93
- Requirements for all countries 93
- Chapter 11 power cord set requirements 94
- Requirements for specific countries and regions 94
- Requirements for specific countries and regions 85 95
- Recycling 96
Похожие устройства
- Dell E5570 (5570-9716) Инструкция по эксплуатации
- HP 17-w011ur (X5W66EA) Инструкция по эксплуатации
- HP G1 (X2F46EA) Инструкция по эксплуатации
- Dell E7270 (7270-0561) Инструкция по эксплуатации
- HP 430 G4 (Y7Z43EA) Инструкция по эксплуатации
- HP 440 G3 (W4N91EA) Инструкция по эксплуатации
- Dell 5558 (5558-8193) Инструкция по эксплуатации
- HP 17-w014ur (X5W69EA) Инструкция по эксплуатации
- Dell 5565 (5565-0576) Инструкция по эксплуатации
- HP 840 G3 (T9X24EA) Инструкция по эксплуатации
- HP G1 (X2F49EA) Инструкция по эксплуатации
- HP 450 G3 (W4P21EA) Инструкция по эксплуатации
- HP 440 G3 (W4N99EA) Инструкция по эксплуатации
- HP 17-ab004ur (X3L26EA) Инструкция по эксплуатации
- HP 15-as101ur (Y5V50EA) Инструкция по эксплуатации
- HP 430 G4 (Y7Z45EA) Инструкция по эксплуатации
- HP 1030 G1 (X2F22EA) Инструкция по эксплуатации
- HP 17-w100ur (X9X96EA) Инструкция по эксплуатации
- Dell 3460 (3460-8964) Инструкция по эксплуатации
- HP 450 G3 (W4P23EA) Инструкция по эксплуатации